† Corresponding author. E-mail:
The design, fabrication, and the characterization of a 0.5-V Josephson junction array device are presented for the quantum voltage standards in the National Institute of Metrology (NIM) of China. The device consists of four junction arrays, each of which has 1200 3-stacked Nb/NbxSi1−x/Nb junctions and an on-chip superconducting microwave circuit which is mainly a power divider enabling each Josephson array being loaded with an equal amount of microwave power. A direct current (dc) quantum voltage of about 0.5 V with a ∼1-mA current margin of the 1st quantum voltage step is obtained. To further prove the quality of NIM device, a comparison between the NIM device with the National Institute of Standards and Technology (NIST) programmable Josephson voltage standard (PJVS) system device is conducted. The difference of the reproduced 0.5-V quantum voltage between the two devices is about 0.55 nV, which indicates good agreement between the two devices. With the homemade device, we have realized a precise and applicable 0.5-V applicable-level quantum voltage.
Since the 1990s, the high-stable non-hysteresis Josephson junction (JJ) has been widely used in quantum voltage standards because of its accurate and stable Shapiro voltage step. The integrated Josephson junction array device is the core element of direct current (dc) and alternating current (ac) quantum voltage standards. Josephson voltage standard devices of 1 V and 10 V have been developed in National Institute of Standards and Technology (NIST), Physikalisch-Technische Bundesanstalt (PTB), and National Metrology Institute of Japan (NMIJ). In NIST, 10-V devices have been realized using about
For many years, the National Institute of Metrology (NIM) of China has been developing large-scale integrated Josephson junction array devices that are the basis for the quantum voltage standard.[11–13] The primary challenge has been to increase the output voltage, which depends on improvements and innovations on circuit design and fabrication process control. In this paper, we present the design, fabrication, and the characterization of a 0.5-V Josephson junction array device for the quantum voltage standard. A tapered transmission line is designed, which is focused on the consideration of dissipative characteristics of Josephson junctions. A whole fabrication process control is conducted and several key steps are improved to improve the performance of our devices. High-quality Nb film deposition technology is explored and the optimal conditions of film sputtering can be found in our previously published paper.[14] In addition, multi-stacked Josephson junctions vertical etching technology, crystal plane fracture in microstructure, and phase shifter configurations in power divider circuits are also researched and improved. Using about 14400 Nb/NbxSi1−x/Nb junctions, 0.516-V applicable-level quantum voltage with a 1.1-mA current margin of the 1st quantum voltage step has been achieved. To further prove the quality of NIM device, we compare the NIM device with NIST programmable Josephson voltage standard (PJVS) device, and a good consistency is obtained. The difference of the reproduced 0.5-V quantum voltage between the two devices is about 0.55 nV, which indicates that the NIM device can be applied to accurately reproduce the quantum voltage.
The rest of this paper is structured as follows. The design and fabrication processes are described in Section
A schematic diagram of basic circuit for 0.5-V JVS device is shown in Fig.
For SNS Josephson junction, microwave power loss may occur under microwave irradiation during working process. Thus, in a large-scale series integrated Josephson array, less microwave power will be received by the end of junction compared to the beginning of array, which will affect the consistency of the Josephson response of junctions in series. Meanwhile, self-emitting power will also be found in Josephson junctions in previous studies.[16,17]
A tapered transmission line makes a compensation on the attenuation effects of junctions, and the constant microwave current is the compensation target to keep the amplitude of microwave currents received by each junction to be constant. This compensation target is realized in circuit design by continuously adjusting characteristic impedance of transmission line with a comprehensive consideration of beginning characteristic impedances, stable resistance of junction, Josephson junction number n, and a correction factor considering self-emission effect of Josephson junction and mismatch in microwave circuit, and so on. Empirical data from our previous measurements and these parameters ranges also take into account the influences of differences caused by fabrication process.
A tapered transmission line with continuously decreasing characteristic impedance from 50 Ω to 40 Ω is used so that each junction receives nearly the same amount of microwave power. Low-pass filters with planar spiral inductor and paralleled resistance are used to apply dc signal and block microwave power. High frequency structure simulator (HFSS) simulations show that the return loss of the power divider is below 0.16 dB at 15 GHz∼22 GHz, and almost equal microwave power division is obtained with each array getting a division of 4.9 ± 0.4 dB of the total microwave power at 15 GHz∼22 GHz.
The coils at the end of each sub-arrays are designed as dc bias and low pass filters that can be realized by resister shunted spiral coil inductors, which can prevent resonances on a broadband signal ranges.
The multi-stage 2-way broadband Wilkinson power divider is designed to realize a π-model equivalent lumped-element that is suitable for on-chip fabrication and decrease physical dimension compared with distributed-elements. The designs are all simulated with Ansoft HFSS and advanced design system.
The optical image of the fabricated device is shown in Fig.
Another noteworthy point is that film stress will be accumulated during multi-layer fabrication, which may lead to a low current capacity of the devices. Crystal fractures in the Nb wiring layers are found in devices with poor current capacity, and we adjust the film stress of sandwich layer into compressive to improve stress accumulation effect, which can effectively improve the current capacity.
The package of 0.5-V JVS device consists of a printed circuit board (PCB), a flexible printed circuit (FPC) interconnected board, and the device. The device sits on a copper pedestal which is a good heat sink and can rapidly dissipate the heat induced by the device to the 4.2-K helium liquid. The CPW transmission line on PCB is simulated and optimized by Ansoft HFSS and advanced design system (ADS). All connecting fingers and transmission lines on the PCB are gold-plated to enhance solderability and at the same time keep the capability of transmitting high frequency signals with low loss. We use sub-miniature version A (SMA) socket as coax-cryopackage connector. The packaged device is mounted at the end of cryo-probe and measured in a 100-L liquid helium Dewar at 4.2 K. A programmable multi-channel current source with high precision and low noise is used to bias junction arrays and an Aglient 33420A digital nano-voltmeter is used to measure the output voltage.
We first measure the dc I–V curve of the array. The critical current
Further experiments show that a 0.583-V voltage can be achieved at 19.6 GHz, but the step width is reduced to about 0.8 mA. One reason to explain this is that thermal effects may be caused at high frequency and microwave power in large-scale integrated junction arrays. Further design will improve the heat dissipation performance both in device circuits and packages.
To fully examine the characteristics of the device, we check the ac I–V characteristics for each sub-array, not only on a fixed microwave frequency but also on a frequency range from 15 GHz to 20 GHz. Figure
To further verify the quality of the 0.5-V JVS device, we compare the NIM device with NIST PJVS device. The comparison method used is the so-called direct comparison where the two devices are biased at the same voltage, the outputs are connected in series opposition, and the two output voltages are compared directly. A schematic diagram of the comparison method is given in Fig.
A total of 20 measurements between the two systems are conducted and the results are shown in Fig.
The difference of the reproduced quantum voltage between the two devices is 0.55 nV, which indicates good agreement between the two devices. The combined standard uncertainty u, which includes both type-A and type-B uncertainty (system error), is 1.6 nV. Therefore, the NIM 0.5-V JVS device is capable of reproducing the applicable-level 0.5-V quantum voltage accurately.
In this paper, we present the design, fabrication, and characterization of NIM 0.5-V JVS device which is based on the Nb/NbxSi1−x/Nb SNS junction technology. A quantum voltage of 0.519686 V with a 1.1-mA current margin is produced with a 3-stacked Josephson junction array under 17.46-GHz microwave radiation. To further prove the quality of NIM device, we compare the NIM device with the NIST PJVS. The difference of the reproduced 0.5-V quantum voltage between the two devices is 0.55 nV, which indicates good agreement between them. These results also verify the validity of our on-chip superconducting microwave circuit design, which can be applied to higher voltage devices in the future.
We thank Li Honghui, Wang Zengmin for the technical assistance and Zhong Qing, Wang Xueshen for the helpful discussion.
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[5] | |
[6] | |
[7] | |
[8] | |
[9] | |
[10] | |
[11] | |
[12] | |
[13] | |
[14] | |
[15] | |
[16] | |
[17] |